The KAILIWEI series of desoldering wires provides a complete range of professional-grade solder removal braids for every precision electronics task. Available in five key widths—1.5mm, 2.0mm, 2.5mm, 3.0mm and 3.5mm—the models 1515, 2015, 2515, 3015 and 3515 deliver consistent, high-performance desoldering for applications ranging from fine-pitch micro-soldering to broad pad cleaning.

Key Features

1. Five Precision Widths for Every Task – The 1515 (1.5mm) is ideal for fine-pitch IC pins and dense BGA pads; the 2015 (2.0mm) is the all-purpose choice for phone motherboards and laptop repairs; the 2515 (2.5mm) offers broader coverage for standard through-hole joints; the 3015 (3.0mm) handles larger pads; and the 3515 (3.5mm) is perfect for heavy solder removal on power components and large joints.
2. High-Purity Copper Construction – Made from fine, oxygen‑free copper strands for excellent thermal conductivity. When heated, the braid absorbs solder evenly, ensuring clean and damage‑free desoldering of sensitive components.
3. Pre-Fluxed with No-Clean Formula – Each wick is saturated with a wash‑free RMA flux that activates upon heating, removing oxides and promoting rapid capillary action. The low‑residue formula leaves minimal non‑corrosive residue, reducing post‑desoldering cleanup time.
4. Soft, Highly Flexible Weave – The precision‑woven plain‑knit construction is soft enough to conform to tight spaces around IC pins and BGA pads without damaging components, while still providing the structural integrity needed for consistent solder absorption.
5. Strong Absorption & Anti‑Oxidation Coating – The combination of pure copper and integrated flux enables fast, strong absorption that pulls up large volumes of solder in a single pass. An anti‑oxidation coating preserves the wick's effectiveness during storage, preventing natural degradation over time.