MA ANT BGA GLUE REMOVER CJY-01
Ratings: 4
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The MA ANT BGA GLUE REMOVER CJY-01 is a professional-grade chemical solution specifically formulated for removing underfill adhesive and hardened glue from BGA (Ball Grid Array) chips, ICs, and motherboards. This powerful yet safe solvent is designed for mobile phone repair technicians and micro-soldering specialists who need to remove chips for reballing, replacement, or rework without damaging delicate components . The eco-friendly formula effectively softens and dissolves various resin adhesives—including phenolic, epoxy, acrylic, polyurethane, and silicone—with fast-acting efficiency . Unlike harsh solvents, the CJY-01 works gently on PCB surfaces while providing powerful dissolving action that leaves no sticky residue, ensuring clean pads for successful soldering . The low-odor formula makes it suitable for daily use in professional repair environments. Available in 250ml and 500ml bottles, this BGA glue remover is an essential consumable for any workshop performing chip-level motherboard repairs on iPhones, Samsungs, and other modern smartphones.
Key Features
- Eco-Friendly New Formula – Specially formulated to quickly soften and dissolve hardened phenolic aldehyde, acrylic epoxy, polyurethane, silicone, and other resin adhesives commonly used in BGA chip underfill
- No Damage to Components – Safe for use on CPUs, BGA chips, ICs, and circuit boards without harming delicate components or PCB traces
- Residue-Free Cleaning – Powerful dissolving action removes glue without leaving sticky residues, ensuring better soldering results for reballing and rework
- Fast-Acting Formula – Softens even the toughest underfill gel within minutes, dramatically reducing waiting time during chip removal procedures
- Low Odor & Eco-Friendly – Features an environmentally conscious formula with mild odor, making it suitable for professional workshop environments
- Multiple Size Options – Available in 250ml and 500ml bottles to suit different workshop needs
- Wide Compatibility – Effective on various adhesive types including phenolic, epoxy, acrylic, polyurethane, and silicone resins
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