The Ma Ant MY-17A is a professional-grade, high-temperature lead-free solder paste specifically formulated for precision electronics assembly, BGA reballing, and micro-soldering repair . With a melting point of 217°C, this paste is fully compliant with RoHS lead-free environmental standards, making it ideal for modern electronics manufacturing and repair where lead-free soldering is required .

This paste addresses the increasing prevalence of lead-free materials in smartphones, tablets, and other consumer electronics. The advanced formula utilizes a silver-infused alloy that significantly enhances conductivity, reduces the risk of false or virtual soldering, and ensures stable, reliable joints that meet the highest quality standards for professional micro-soldering tasks .

Key Features

• 217°C High-Temperature Melting Point – Lead-free, RoHS-compliant formulation specifically designed for high-temperature reflow profiles required by modern electronics assembly standards. Fully compatible with lead-free component soldering 
• Upgraded Silver-Infused Formula – Contains added silver particles that significantly improve conductivity, reduce virtual/False soldering (cold joints), and deliver superior electrical performance essential for critical signal integrity applications 
• Fine 20-38μm Particle Size – Precision-graded powder ensures smooth paste flow, prevents stencil clogging, and enables consistent deposit volumes on fine-pitch components down to 0.4mm pitch, providing uniform and delicate tin beads 
• No-Clean Flux with High Efficiency – High-activity flux delivers strong wetting and adhesion while leaving minimal post-solder residue. In most applications, no cleaning is required, saving valuable time in production and repair workflows 
• Excellent Wetting & Flow Characteristics – Superior formulation ensures the paste melts evenly, spreads smoothly onto pads, and forms bright, full (complete), high-strength solder joints resistant to cracking or bridging 
• Smooth & Uniform Texture – Fine, sticky consistency prevents tin bubbling during reflow, ensures uniform solder ball formation, and provides long stencil life for consistent application across multiple production cycles 
• High Resistance & Strong Welding Ability – Provides durable joints with excellent mechanical strength and vitality, specifically engineered for demanding rework environments 
• Available in 50g Standard Professional Size – Convenient 50g container (jar or syringe format) provides ample material for both repair shops and production environments