The Ma Ant MY-38A is a professional-grade, ultra-low temperature lead-free solder paste specifically formulated for heat-sensitive electronics assembly and repair. With an industry-leading melting point of just 138°C, this Sn42/Bi58 alloy paste is the ultimate solution for protecting delicate components during soldering operations .

This paste is engineered for critical applications where standard soldering temperatures would cause damage. Its low thermal profile protects adjacent plastic connectors, flex cables, and multi-layer PCB substrates while producing strong, reliable solder joints. The no-clean flux formula leaves minimal residue, reducing post-solder cleaning requirements and enabling efficient workflow in professional repair environments .

Key Features

• Ultra-Low 138°C Melting Point – Industry-leading low temperature protects heat-sensitive CPUs, BGAs, plastic connectors, and flex cables during rework, preventing PCB warping and component damage 
• Sn42/Bi58 Lead-Free Alloy Composition – 42% Tin, 58% Bismuth – environmentally friendly and RoHS compliant, with added silver particles in premium formulations for enhanced conductivity 
• Fine 25-40μm Particle Size – Ensures smooth paste flow, prevents stencil clogging, and enables precise application on fine-pitch components down to 0.4mm pitch 
• No-Clean Flux with Excellent Wetting – High-activity flux ensures strong adhesion and reliable solder joints while leaving minimal residue, eliminating post-solder cleanup in most applications 
• High Adhesion & Stable Consistency – Smooth, sticky texture prevents tin bubbling during reflow and provides long stencil life for consistent application 
• Versatile Application Compatibility – Suitable for both manual soldering and automated processes; works with hot air, reflow ovens, and soldering irons 
• Convenient 50g Packaging – Available in jar or syringe format (10g–50g), with 50g being the standard professional size