The Ma Ant MY-58A is a professional-grade, low-temperature lead-free solder paste specifically formulated for micro-soldering and precise electronic repairs . With a melting point of 158°C, this SnBi alloy paste offers a perfect middle-ground solution—higher than 138°C variants to reduce joint brittleness, yet lower than 183°C leaded paste to protect heat-sensitive components .

This paste is engineered with an upgraded silver-infused formula that significantly enhances conductivity and reduces the risk of false soldering . The 25-40μm fine particle size ensures smooth application, prevents tin bubbling, and provides uniform solder ball formation—critical for BGA reballing and fine-pitch component assembly .

Key Features

• 158°C Low Melting Point – Provides a balance between thermal protection for sensitive components and reliable joint strength; protects CPUs, plastic connectors, and flex cables during micro-soldering operations 
• Silver-Infused Lead-Free Alloy (SnBi + Ag) – The upgraded formula contains silver particles that greatly improve conductivity and reduce virtual soldering, delivering superior electrical performance 
• Fine 25-40μm Particle Size – Ensures smooth paste flow, prevents stencil clogging, and enables precise application on fine-pitch components and BGA balls 
• No-Clean Flux Formula – Leaves minimal residue after soldering, reducing post-solder cleaning requirements; high-activity flux ensures excellent wetting and adhesion 
• Smooth & Uniform Texture – Fine and sticky consistency prevents tin bubbling and ensures uniform solder ball formation, resulting in firm, reliable joints 
• Excellent Wettability – Strong wetting properties ensure smooth solder flow onto pads and component leads, producing bright, shiny joints 
• Available in Multiple Packaging Sizes – Comes in convenient packaging options ranging from 10g to 50g, with 50g being the standard professional size 
• CE & ROHS Compliant – Meets international safety and environmental standards for lead-free soldering.