MECHANIC Solder Paste ZC50 SMD Solder Paste Flux 158°C
Ratings: 4
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The MECHANIC ZC50 Solder Paste is a professional-grade, medium-temperature solder paste specifically formulated for SMD soldering, BGA reballing, and mobile phone motherboard repair . With a melting point of 158°C, this paste occupies the critical mid-range temperature slot—lower than standard lead-free SAC alloys (217°C) to protect sensitive boards, yet higher than ultra-low temp alloys (138°C) to deliver stronger, more reliable joints.
Key Features
- 158°C Medium Melting Point – Provides balanced thermal performance; protects heat-sensitive components while delivering strong, reliable joints
- Lead-Based Alloy (Sn52Pb42.5Bi3Sb0.5) – Contains tin, lead, bismuth, and antimony for superior wettability and shiny, reliable solder joints
- IPX6 Flux Rating – High-activity flux with excellent oxidation resistance, at least twice as effective as standard solder pastes
- No-Clean Formula – Leaves minimal, non-corrosive residue on PCBs; no post-solder cleaning required in most applications
- Bright, Full Solder Joints – Produces shiny, high-strength joints with strong solder climbing and excellent conductivity
- Long Storage Life After Opening – Enhanced formula provides extended shelf life even after the container has been opened
- Fine 4.3# Particle Size – Precision-graded powder ensures smooth application and consistent performance on fine-pitch components
History
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