The MIJING IPX 861 Hot Gun Air Nozzle is a professional-grade replacement and upgrade nozzle designed specifically for the Quick 861DW SMD hot air rework station. Engineered for precision soldering applications, this nozzle ensures optimal heat distribution and airflow for delicate electronics repair work. The IPX 861 designation indicates its suitability for mobile phone motherboard repair, BGA chip rework, IC removal, and other precision SMD applications where accuracy is paramount.

Key Features

• Precision-engineered for Quick 861DW – Specifically designed to be compatible with the Quick 861DW SMD hot air rework station, ensuring a perfect fit and optimal performance 
• IPX designation for specialized use – The IPX 861 model is optimized for precision soldering applications, including mobile phone motherboard repair and BGA rework
• Multiple size options available – Available in various inner diameters (e.g., 8mm and other sizes) to accommodate different component sizes, from small ICs to larger BGA chips 
• Compatible with microscope work – Designed to work seamlessly with microscopes, allowing technicians to maintain a clear view of the work area during precision soldering operations
• Durable heat-resistant construction – Built from high-quality materials capable of withstanding temperatures up to 500°C, matching the Quick 861DW's maximum temperature range 
• Quick friction-fit installation – Features easy push-on/pull-off attachment compatible with the Quick 861DW's fast nozzle change system