The MIJING MJ217A is a professional-grade, lead-free, high-temperature solder paste designed for precision electronics assembly and repair. With a melting point of 217°C, this paste is specifically formulated to meet RoHS lead-free standards and is ideal for reballing BGA chips, ICs, and other surface-mount components on high-density PCBs.

Incorporating high-purity silver particles, the MJ217A ensures superior electrical conductivity and joint strength. Its advanced no-clean flux formula provides excellent wettability while minimizing post-solder residue, making it a reliable choice for demanding micro-soldering tasks such as smartphone motherboard repair and computer rework.

Key Features

• High-Temperature Resistance: The 217°C melting point complies with standard SAC (Tin-Silver-Copper) lead-free reflow profiles, ensuring compatibility with modern motherboards. It prevents "cold joints" caused by low-temperature paste in high-performance chips.
• Silver-Containing Formulation: Infused with high-conductivity silver particles, the MJ217A reduces contact resistance, making it highly effective for CPU and power IC soldering where signal integrity and low impedance are critical.
• Smooth Printing Performance: Utilizing a fine-pitch powder (typically 25-45µm), this paste flows easily through high-density stencils, preventing clogging and ensuring consistent solder volume on 0.4mm pitch BGA pads.
• No-Clean Flux System: The flux offers excellent active wetting to remove oxides but leaves a minimal, transparent residue that is non-corrosive and non-conductive, eliminating the need for cleaning in most applications.