The Non‑metallic BGA Pry Rod is a specialized tool designed for safely extracting BGA (Ball Grid Array) chips, CPUs, NAND memory, and other ICs from multi‑layer PCBs. When hot air rework is performed on a logic board, the surrounding area becomes extremely hot. Unlike metal tools that conduct heat and risk damaging delicate traces, this pry rod provides a safe, heat‑resistant fulcrum for lifting components once the solder has reflowed.

By using a dedicated non‑metallic pry tool, technicians significantly reduce the risk of tearing pads, scratching the motherboard, or shorting adjacent components—making it an essential accessory for high‑quality board‑level repairs.

Key Features

• Heat‑Resistant, Non‑Metallic Construction – Made from high‑temperature resistant material that stays cool and will not transfer heat back into the board or the technician's hand during hot air rework .
• ESD‑Safe & Anti‑Static – The material prevents electrostatic discharge, protecting sensitive ICs and the logic board from static damage.
• Precision Angled Tip – The finely engineered tip is designed to slide effortlessly under BGA chips without snagging on tiny peripheral components (such as capacitors) near the processor area.
• Ergonomic Lightweight Design – Low mass and a comfortable profile reduce hand fatigue during long soldering sessions, providing better tactile feedback for precise lifting.
• No Risk of Shortening Pins – Eliminates the risk of using improvised metal tools that might accidentally bridge or scratch exposed copper traces.