Qianli 007 Glue Removal Knife IC BGA NAND CPU Edge Glue Cleaning Knife
Ratings: 4
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The Qianli 007 Glue Removal Knife is a professional precision repair tool specially designed for IC glue removal, BGA cleaning, NAND repair, CPU edge cleaning, and motherboard maintenance. Engineered for delicate chip-level repair work, this knife allows technicians to safely remove adhesive, black glue, and residue from sensitive electronic components with greater accuracy and control.
Built with a high-quality precision blade, the Qianli 007 provides excellent flexibility, durability, and sharpness for working around CPUs, IC chips, NAND flash, and motherboard circuits. Its specialized edge design helps technicians access narrow spaces while minimizing the risk of damage to surrounding components during repair operations.
Ideal for mobile phone repair technicians, microsoldering professionals, and refurbishment centers, the Qianli 007 Glue Removal Knife improves repair efficiency and provides reliable performance for advanced motherboard repair tasks.
Key Features
- Designed for IC, BGA, NAND, and CPU glue removal
- Precision blade for delicate motherboard operations
- Suitable for chip-level repair and maintenance
- High-strength and wear-resistant construction
- Excellent control for cleaning adhesive and residue
- Ideal for microsoldering and motherboard repair work
- Professional tool for electronics repair technicians
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