The Quick 861DW 1300W Flagship Edition is a professional-grade, ultra-powerful BGA soldering and hot air rework station engineered for high-performance chip-level desoldering on mobile phone motherboards, ASIC miner circuit boards, and professional PCB repair applications. Delivering 1300W of heating power with a maximum temperature of 500°C and adjustable airflow up to 90L/min (200 levels), this flagship model offers significantly higher thermal capacity than the standard 1000W 861DW version—making it the go-to choice for technicians who demand exceptional performance for demanding rework tasks .

Key Features

• Ultra-Powerful 1300W Flagship Performance – Delivers exceptional thermal output for professional BGA desoldering, component removal, and PCB rework on mobile phone motherboards and ASIC miner circuit boards 
• 100-500°C Wide Temperature Range – Versatile temperature control suitable for everything from delicate SMD components to high-temperature lead-free BGA chips 
• 90L/min Maximum Airflow (200 Levels Adjustable) – Powerful yet precise brushless vortex fan with wide-range stepless airflow adjustment for various component sizes 
• 3 Programmable Memory Channels (CH1/CH2/CH3) – Each channel independently stores temperature and airflow settings for quick recall of commonly used profiles 
• Closed-Loop Sensor with Microcomputer Zero-Crossing Control – Delivers precise, accurate temperature regulation unaffected by airflow changes for consistent, reliable heating 
• Magnetic Switch with Auto Sleep & Cooling – Handle automatically enters sleep mode when placed on stand, extending heater life. System also features automatic large-air volume cooling function