The YCS 2015 Desoldering Wick is a professional-grade solder removal braid designed for precision electronics repair. Featuring a high-purity oxygen-free copper construction and an optimized 2.0mm width, this 1.5-meter wick delivers fast, clean, and efficient solder absorption for mobile phone motherboard repair, BGA rework, PCB assembly, and general desoldering tasks. The pre-fluxed rosin formula leaves minimal residue, reducing cleanup time and ensuring professional-grade results. Trusted by repair technicians worldwide, the YCS 2015 is your go-to solution for clean, reliable solder removal.

Key Features

1. High-Purity Oxygen-Free Copper Material – Manufactured from premium oxygen-free copper strands that ensure superior electrical and thermal conductivity, enabling fast and efficient heat transfer to melt and absorb solder quickly without damaging nearby components.
2. 2.0mm Optimized Width for Precision Work – The 2.0mm width strikes the perfect balance between coverage and control – wide enough to efficiently remove solder from standard PCB pads, yet narrow enough to access tight BGA joints and fine-pitch components commonly found in smartphones, tablets, and laptops.
3. Pre-Fluxed with Rosin for Strong Absorption – Each wick is factory pre-fluxed with a high-quality rosin core that activates upon heating, maximizing its ability to absorb molten solder cleanly and thoroughly without damaging delicate pads or components. The wick is also coated with anti-oxidation technology to maintain long-term effectiveness.
4. Low Residue & Non-Corrosive Formula – Leaves minimal, non-corrosive solder residue after use, significantly reducing post-desoldering cleanup time and effort. The no-clean properties ensure a safer working environment and prevent long-term damage to your PCBs.
5. Flat Needle Weaving Design – Engineered with a new, flat needle weaving process that prevents fraying and ensures consistent, reliable performance throughout the entire 1.5m length. This design also allows the wick to be soft yet sturdy, conforming to board contours for maximum contact and absorption.