The YCS 50g Solder Paste 138℃ is a professional-grade, low-temperature lead-free solder paste designed for precision electronics repair. With a melting point of 138℃, this paste is specifically formulated for heat-sensitive components, making it ideal for BGA reballing, CPU repair, and PCB assembly where standard solder temperatures could damage delicate components .

This 50g paste is engineered to meet the demands of modern electronics repair, particularly for mobile phone motherboard repairs, IC soldering, and scenarios where board warping or component damage is a concern. The formulation achieves high fluidity and stability, ensuring precise solder ball placement and reliable solder joints .

Key Features

• 138℃ Low Melting Point – Low-temperature formulation protects adjacent heat-sensitive components and prevents PCB warping during rework 
• Excellent Anti-Oxidation Performance – Maintains integrity during heating, preventing oxidation that can compromise solder joint quality 
• Non-Collapse Formula (Stable Viscosity) – Features a viscous, smooth consistency rated at 138/158/183 viscosity levels, ensuring no collapse or chip offset during placement 
• Strong Wettability – Uniform and delicate texture with excellent wetting properties for quality soldering and desoldering repairs 
• Low Residue / No-Clean – Leaves minimal flux residue after soldering, often requiring no post-solder cleaning 
• Bright, Full Solder Joints – Produces shiny, high-strength solder joints with strong activity, resistant to poor welding or false welding 
• Portable 50g Packaging – Compact size makes the paste easy to handle, store, and transport, ideal for both workshop use and field repairs