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  1. Home
  3. GSM Bazar
  5. Mobile Repair Tools & Equipment

YCS Tin-planting Arc Pad

Ratings: 4

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The images shown are for reference purposes only. Actual product packaging and materials may include additional or different information than what is displayed on our app or website. We recommend that you do not rely solely on the information provided here and that you always read product labels, warnings, and usage directions before use or consumption.

The YCS Tin-planting Arc Pad is a professional repair support accessory designed for BGA reballing, IC chip tin planting, and precision motherboard soldering work. Made from high-temperature resistant material, this arc-shaped support pad helps stabilize IC chips and steel mesh during soldering and tin planting operations. Its curved ergonomic design improves positioning accuracy and heat distribution, making it ideal for mobile phone motherboard repair, CPU reballing, and micro soldering applications.

Features:

  • Professional tin-planting support arc pad
  • High-temperature resistant durable material
  • Stable support for IC chip and stencil positioning
  • Curved ergonomic design for precise repair work
  • Suitable for BGA reballing and tin planting operations
  • Helps improve soldering stability and efficiency
  • Ideal for mobile phone motherboard and PCB repair
  • Lightweight and easy-to-use professional accessory
  • Durable reusable design for long-term repair work
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Shipping fee and delivery date to be calculated at checkout based on your location and the seller's shipping policies.



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Model: YCS Tin-Plating

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Variations: 1

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