ZJWY Removal liquid G-880（500ml) Can replace 660 and 680, recommended.
Ratings: 4
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The ZJWY G-880 is a high-performance removal liquid specifically formulated to dissolve, swell, or soften cured adhesives and underfill on printed circuit boards. It is designed as a direct upgrade or replacement for older models (660/680), offering higher efficiency and lower volatility. It is ideal for separating the middle layer of iPhone motherboards and reworking BGA chips.
Key Features
- High Efficiency: Capable of quickly penetrating the bottom layer of large IC chips, effectively softening underfill without damaging the motherboard pads [citation:1].
- Low Volatility (LV): Features an optimized formula that reduces rapid evaporation, allowing more time for the chemical to react with the adhesive.
- Non-Toxic & Eco-Friendly: Compared to traditional organic solvents, it offers a safer formula with reduced harmful odor, meeting modern environmental standards.
- 500ml Bulk Packaging: Suitable for high-volume repair shops, reducing waste compared to small bottles.
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